Homogeneous/Heterogeneous Metal Bonding

同类/异类金属键合

It bonds heterogeneous metals well, which was hard to achieve with conventional bonding method. Needless to solder, you can bond them directly at room temperature

它可在室温下直接键合异质金属，这是传统焊接方法难以实现的。

IGBT Module (Terminal bonding)

IGBT模块（终端连接）

It is desirable to bond without soldering when dealing with IGBT module, which requires high temperature during operation. Ultrasonic bonds the lead on the package side and the electrode on the DBC substrate directly

在处理IGBT模块时，无需传统的高温焊接。超声波将封装侧导线和DBC基板上电极直接键合